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New Supermicro solutions leverage Red Hat Enterprise and OpenStack Platforms to deliver an integrated optimized solution for cloud infrastructure.

At the Red Hat Summit in San Jose, CA, Supermicro announced open source solutions for Red Hat Enterprise Linux, Ceph and OpenStack platforms.

Supermicro SuperServer Solutions for Red Hat Enterprise Linux OpenStack Platforms

1U/2U Ultra SuperServers deliver performance, flexibility, scalability and reliability.

Dual Intel® Xeon® E5-2600 v3 (up to 36 cores and 160W TDP), 3TB DDR4 2133MHz in 24x DIMMs, 2.5” hot-swap NVMe SSD 2x in 1U, 4x in 2U, SATA3 and SAS3 12Gb/s support, up to 8x PCI-E 3.0 slots in 2U, 10GBase-T and 10G SFP+ support, IPMI 2.0 + KVM with dedicated LAN, redundant Titanium level high-efficiency (96%+) digital power supplies.

2U TwinPro™ (2-node), 2U TwinPro²™ (4-node) SuperServers

Dual Intel® Xeon® E5-2600 v3 (up to 36 cores and 145W TDP), up to 1TB DDR4, 2133MHz LRDIMM in 16x DIMMs, PCI-E 3.0 x16, PCI-E 3.0 x8 LP (2U TwinPro™), and "0 slot" flexible rear expansion for add-on card solutions such as PCI-E SSD, 10GbE with SFP+, or GPU/Xeon Phi; 10GBase-T, InfiniBand, or Gigabit Ethernet networking options; up to 4x NVMe and 8x SAS3 12Gbps 2.5" hot-swap SSDs per node; co-processor support (2U TwinPro™); IPMI 2.0 + KVM with dedicated LAN; SATA DOM power connector; TPM 1.2 header; and redundant Titanium Level high-efficiency (96%+) digital power supplies.

4U FatTwin™ high-density 8/4/2 hot-plug node SuperServers

Dual Intel® Xeon® E5-2600 v3 (up to 36 cores and 145W TDP), up to 1TB DDR4 2133MHz Reg. ECC in 16x DIMMs, PCI-E 3.0, up to 8x 3.5" hot-swap HDD bays per U in 4U 4-node or up to 6x double-width NVIDIA® GPU/Intel® Xeon® Phi Coprocessor per node in 4U 2-node configuration NVMe, SAS3 12Gbps, SATA3 6Gb/s, GbE, 10GBase-T, IPMI 2.0 with KVM over dedicated LAN, redundant Titanium Level high-efficiency (96%+) digital power supplies.

3U MicroCloud 24/12/8 hot plug node SuperServers

Multiple nodes support Intel® Xeon® processor E5-2600 v2/v3, Intel® Atom™ processor C2750 SoC (20W, 8-Core), E3-1200 v2/v3/v4 family, Intel® 4th/5th Gen Core™ socket H3 from 13W to 84W, AMD Opteron™ 3000 series (3300 ready) processor, 8/4-Core; Socket AM3+, up to 256GB LRDIMM, 128GB RDIMM, up to 2133MHz DDR4 ECC or up to 64GB DDR3 VLP ECC UDIMM 1600MHz support, 2x 3.5" hot-swap SATA3/SAS, 2x 2.5" SATA3 HDD/SSDs or 2x 3.5" SATA3; optional kit for 4x 2.5" SATA (2x SATA3 + 2x SATA3) HDDs, Low-profile PCI-E x8 expansion support, IPMI 2.0 with KVM over dedicated LAN, redundant 1620W Titanium Level high-efficiency (96%+) digital power supplies.

This powerful and flexible 6U MicroBlade is extreme-density and features 112/56/28 hot-swappable MicroBlade server nodes.

Supports DP/UP Intel® Xeon® E5-2600 v3, E3-1200 v4, D-1500, or Intel® Atom™ C2000 processors, and up to 4 HDDs/SSDs and a SATADOM per server. MicroBlade enclosure can incorporate up to 2 Chassis Management Modules, and up to 4/2x 10/2.5/1/GbE SDN switches for efficient, high-bandwidth communications. It can incorporate up to 8x redundant (N+1 or N+N) 2000W/1600W Titanium/Platinum Level high-efficiency (96%/95%) power supplies with cooling fans.

The new and powerful 3U MicroBlade provides flexible and extreme-density, all-in-one total system that features 56/28/14 hot-swappable MicroBlade server nodes.

Supports Intel® Xeon® E5-2600 v3, E3-1200 v4, D-1500, or Intel® Atom™ C2000 processors, and up to 4x HDD/SSDs and 1x SATADOM per server. MicroBlade enclosure can incorporate 1 Chassis Management Module, and up to 2x 25/10/2.5/1GbE SDN switches for efficient, high-bandwidth communications. It also features up to 4x redundant (N+1 or N+N) 2000W/1600W Titanium/Platinum Level high-efficiency (96%/95%) power supplies with cooling fans.

7U SuperBlade® features maximum density, affordability, reduced management costs, lower power consumption, optimal ROI, and high scalability.

Supports Intel® Xeon® Processor E5-2600 v3, up to 6x DIMM slots, 1TB LRDIMM, 512GB RDIMM or 128GB UDIMM, 2x Intel® Xeon Phi™ or NVIDIA® Tesla Kepler K10X/K20M/K40M/K20X/K80; GRID K1/K2 (GPU Blade), up to 3x hot-plug NVMe + 3x hot-swap SAS3 12Gb/s HDDs or 6x Hot-swap 2.5" SAS3 HDD Bays (StorageBlade), 4x QDR (40Gb) InfiniBand or 10GbE mezzanine HCA, Platinum Level high-efficiency (96%+) digital power supplies with cooling fans.

In the following video, Inktank discusses how to get you started with Ceph and OpenStack and why they are the best choice for cloud storage.


Steve Grady is the VP Customer Solutions
Email him at steve.grady@equuscs.com for new business Opportunities
Follow us on LinkedIn or Twitter @EquusCS.

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