Designed for Hyperscale and Cost Effectiveness The MicroCloud modular architecture provides high density, serviceability and cost effectiveness required for today’s demanding hyperscale deployments. The 24/12/8 modular server nodes are conveniently integrated into a compact 3U chassis that is less than 30 inches deep, saving over 76% of rack space when compared to traditional 1U servers.
Power and Density Optimized The MicroCloud family offers hyperscale data center optimized single socket computing solutions with the latest lower-power and high-density system-on-chip (SoC) processors, including Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors to enable a wide range of flexible and scalable cloud and edge computing solutions.
Front I/O Option for Easy Access and Serviceability
Power and I/O ports are located at the front of the chassis for rapid server provision, upgrades, and service. Rear I/O option is also available when hot-swappable storage