Lenovo ThinkSystem SR630 V4 Server

CPU: 2x Intel Xeon 6700-series processor with E-cores, up to 144 cores (no Hyper-Threading), TDP ratings up to 330W

MEM: Up to 32 DDR5 memory DIMMs, 16 DIMMs per processor

STO: Front: 10x 2.5” SAS/SATA/NVMe drives OR Front: 16x E3.S 1T NVMe hot-swap drive bays

EXP: Up to 3x PCIe Gen 5 slots + 2x OCP slots at the rear of the server OR Two OCP 3.0 slots at the rear

PWR: 800W, 1300W, 2000W AC Platinum/Titanium Hot Plug PSUs OR DC Options

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• Virtualization and server consolidation
  This is the strongest general-purpose fit because the SR630 V4 combines very high CPU density, up to 8TB of memory, and a compact 1U form factor, making it well suited to consolidating many VMs while reducing rack footprint.

• Cloud / scale-out compute nodes
  Lenovo explicitly positions it for high-density and scale-out workloads, and the platform’s high core counts, dual OCP networking slots, PCIe 5.0 expansion, and support for fast Ethernet/InfiniBand adapters make it a strong fit for CSP-style compute pools and horizontally scaled application clusters.

• Database and in-memory analytics workloads
  The SR630 V4 is a strong candidate for databases because it offers high memory capacity, fast DDR5, MRDIMM support up to 8000 MT/s on P-core CPUs, and dense NVMe options. Lenovo also offers a SAP HANA variant, which reinforces suitability for memory- and throughput-intensive data platforms.

• Hyperconverged infrastructure and NVMe-heavy software-defined storage
  With onboard NVMe connectivity, support for front and rear NVMe, hot-swap M.2 boot options, and up to 16 E3.S NVMe bays, this server is well matched to HCI nodes and storage-performance-sensitive clustered platforms where low-latency flash and efficient slot usage are important.

• Telecom edge / power-efficient edge compute
  The 1U density, support for -48V DC and HVDC power options, flexible networking, and optional Neptune liquid cooling make it especially attractive for telco and edge deployments where power profile, thermal efficiency, and compact footprint matter.